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The hard copper containing solder (L-Cu) connection in Figure 4 is designed to be forced with a force of fully variable F 18000 N. What should be the distance I accordingly?

The hard copper containing solder (L-Cu) connection in Figure 4 is designed to be forced with a force of fully variable F 18000 N. What should be the distance I accordingly?

Elements Of Electromagnetics
Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
ChapterMA: Math Assessment
Section: Chapter Questions
Problem 1.1MA
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The hard copper containing solder (L-Cu) connection in Figure 4 is designed to be forced with a force of fully variable F 18000 N. What should be the distance I accordingly?

Table A-6.1-2 Strength and safety stress of solder joints (N / mm²) Vibrating Solder material Tiem fully Static TIK OIK Tlem Tlem vatate Copper L-Cu Copper-Zinc L-CuZn Silver base L-Ag 150 - 220 250 - 300 150 - 280 200 - 300 250 - 300 300 - 400 50 - 70 80 - 90 50 - 70 30-40 55 - 65 30 - 40 15 - 25 Aluminum L-Alsi (0.6-0.8) sc 0,1 TK 0.35 TIK 0.18 Tick Nickel L-Ni OK-Base materials tensile strength
Transcribed Image Text:Table A-6.1-2 Strength and safety stress of solder joints (N / mm²) Vibrating Solder material Tiem fully Static TIK OIK Tlem Tlem vatate Copper L-Cu Copper-Zinc L-CuZn Silver base L-Ag 150 - 220 250 - 300 150 - 280 200 - 300 250 - 300 300 - 400 50 - 70 80 - 90 50 - 70 30-40 55 - 65 30 - 40 15 - 25 Aluminum L-Alsi (0.6-0.8) sc 0,1 TK 0.35 TIK 0.18 Tick Nickel L-Ni OK-Base materials tensile strength
4. The hard copper containing solder (L-Cu) connection in Figure 4 is designed to be forced with a force of fully variable F 18000 N. What should be the distance I accordingly? Figure 4: Problem 4 Π=9
Transcribed Image Text:4. The hard copper containing solder (L-Cu) connection in Figure 4 is designed to be forced with a force of fully variable F 18000 N. What should be the distance I accordingly? Figure 4: Problem 4 Π=9
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